Paresh Chaudhary 8fede567b8 iio:temperature:max31856:Add device tree bind info ... This patch added device tree binding info for MAX31856 driver. Signed-off-by: Paresh Chaudhary <paresh.chaudhary@rockwellcollins.com> Signed-off-by: Matt Weber <matthew.weber@rockwellcollins.com> Signed-off-by: Patrick Havelange <patrick.havelange@essensium.com> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>		2019-04-04 20:21:03 +01:00
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max31856.txt	iio:temperature:max31856:Add device tree bind info	2019-04-04 20:21:03 +01:00
maxim_thermocouple.txt	iio: temperature: add support for Maxim thermocouple chips	2016-07-10 14:44:03 +01:00
mlx90614.txt	iio: mlx90614: Add power management	2015-04-09 15:09:16 +01:00
mlx90632.txt	dt-bindings: iio: temperature: add MLX90632 device bindings	2018-02-04 10:19:52 +00:00
temperature-bindings.txt	dt-bindings: iio/temperature: Add thermocouple types (and doc)	2019-04-04 20:21:01 +01:00
tmp007.txt	dt-bindings: remove 'interrupt-parent' from bindings	2018-07-25 14:09:39 -06:00
tsys01.txt	dt-bindings: iio: temperature: Add bindings for TSYS01 temperature sensor	2017-07-01 10:16:44 +01:00